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product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 tsz22111 14 001 www.rohm.com h-bridge drivers for dc brush motors single h-bridge driver high-speed switching type BD6376GUL general description the BD6376GUL provides a single h-bridge motor driver which features wide range of motor power supply voltage from 2.0v to 9.0v and low power consumption to switch low on-resistance dmos transistors at high speed. this small surface mounting package is most suitable for mobile system, home appliance and various applications. features ? low on-resistance power dmos output ? charge pump-less with pdmos high-side driver ? under voltage locked out protection & thermal shut down function applications ? mobile system ? home appliance ? amusement system, etc key specifications ? power supply voltage range: 2.5v to 3.6v ? motor power supply voltage range: 2.0v to 9.0v ? circuit current (open mode): 360 a(typ) ? stand-by current: 1 a(max) ? control input voltage range: 0v to v cc v ? logic input frequency: 200khz(max) ? minimum logic input pulse width: 0.5 s(min) ? turn on time: 200ns(typ) ? turn off time: 60ns(typ) ? h-bridge output current (dc): -1.0a to +1.0a ? output on-resistance (total): 0.45 ? (typ) ? operating temperature range: -30c to +85c package w(typ) x d(typ) x h(max) vcsp50l1 1.60mm x 1.60mm x 0.55mm typical application circuit vcsp50l1 ps vcc 1f to 100f outa outb vm gnd bandgap tsd & uvlo a2 a3 a1 power save pgnd level shift & pre driver ina inb b3 b2 logic power-saving h: active l: stand-by motor control input bypass filter capacitor for power supply bypass filter capacitor for power supply h-bridge full on 1f to 100f c1 c3 b1 c2 datashee t downloaded from: http:///
datasheet d a t a s h e e t 2/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL pin configuration pin description pin no. pin name function a1 vcc power supply a2 gnd ground a3 ps power-saving function b1 vm motor power supply b2 inb control logic input b b3 ina control logic input a c1 outa h-bridge output a c2 pgnd motor ground c3 outb h-bridge output b block diagram 1 2 3 a vcc gnd ps b vm inb ina c outa pgnd outb ps vcc outa outb vm gnd bandgap tsd & uvlo a2 a3 a1 power save pgnd level shift & pre driver ina inb b3 b2 logic b1 h-bridge full on c2 c3 c1 (top view) downloaded from: http:///
datasheet d a t a s h e e t 3/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL description of blocks 1. power-saving function a power-saving function is included, which allows the system to save power when not driving the motor. the voltage level on this pin should be set high so as to keep the oper ation mode. (see the electric al characteristics; p.4/14) 2. motor control input: ina and inb pins logic level controls the output logic of h-bridge. (see the electrical characteristics; p.4/14, and i/o trut h table; p.7/14) absolute maximum ratings (ta=25c) parameter symbol limit unit power supply voltage v cc -0.3 to +4.5 v motor power supply voltage v m -0.3 to +10.0 v control input voltage v in -0.3 to +v cc +0.3 v power dissipation pd 0.72 (note 1) w h-bridge output current (dc) i out -1.0 to +1.0 (note 2) a storage temperature range tstg -55 to +150 c junction temperature tjmax 150 c (note 1) reduced by 5.8mw/c over 25c, when mounted on a glass epoxy 8-layers board (50mm x 58mm x 1.75mm). (note 2) must not exceed pd, aso, or tjmax of 150c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol min typ max unit power supply voltage v cc 2.5 - 3.6 v motor power supply voltage v m 2.0 - 9.0 v control input voltage v in 0 - v cc v logic input frequency f in 0 - 200 khz minimum logic input pulse width t in 0.5 - - s operating temperature range topr -30 - +85 c downloaded from: http:///
datasheet d a t a s h e e t 4/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL electrical characteristics (unless otherwise specified v cc =3.0v, v m =5.0v, ta=25c) parameter symbol min typ max unit conditions all circuits stand-by current i ccst - 0 1 a v ps =0v circuit current 1 i cc1 180 360 550 a v ps =3v, open mode circuit current 2 i cc2 180 375 550 a v ps =3v, cw & ccw mode circuit current 3 i cc3 180 375 550 a v ps =3v, short brake mode ps input (ps) high-level input voltage v psh 2.0 - v cc v low-level input voltage v psl 0 - 0.7 v high-level input current i psh 6 15 30 a v ps =3v low-level input current i psl -1 0 +1 a v ps =0v control input (in=ina, inb) high-level input voltage v inh 2.0 - v cc v low-level input voltage v inl 0 - 0.7 v high-level input current i inh 6 15 30 a v in =3v low-level input current i inl -1 0 +1 a v in =0v under voltage locked out (uvlo) uvlo voltage v uvlo 2.0 - 2.4 v full on type h-bridge driver output on-resistance r on - 0.45 0.60 ? i out =500ma, high & low-side total turn on time t on0 - 200 400 ns 20 ? loading turn off time t off0 - 60 400 ns 20 ? loading downloaded from: http:///
datasheet d a t a s h e e t 5/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL typical performance curves (reference data) figure 1. circuit current vs supply voltage (stand-by mode) figure 2. circuit current vs supply voltage (open mode) figure 3. output vds vs output current (output on-resistance on high-side, v m =5v, v cc =3v) figure 4. output vds vs output current (output on-resistance on low-side, v m =5v, v cc =3v) 0.0 0.5 1.0 1.5 01234 power supply voltage : v cc [v] circuit current : i cc [ma] top 85c mid 25c low -30c operating range (2.5v to 3.6v) 0 50 100 150 200 250 300 0 250 500 750 1000 output current : i out [m a] output vds : v dsh [mv] top 85c mid 25c low -30c 0 50 100 150 200 250 300 0 250 500 750 1000 output current : i out [m a] output vds : v dsl [mv] top 85c mid 25c low -30c 0 1 2 3 4 5 01234 power supply voltage : v cc [v] circuit current : i cc [ a] top 85c mid 25c low -30c operating range (2.5v to 3.6v) downloaded from: http:///
datasheet d a t a s h e e t 6/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL typical performance curves (reference data) - continued 0.0 0.2 0.4 0.6 0.8 1.0 024681 0 motor power supply voltage : v m [v] output on resistance : r on [ ? ] top 85c mid 25c low -30c 0.0 0.2 0.4 0.6 0.8 1.0 024681 0 motor power supply voltage : v m [v] output on resistance : r on [ ? ] top 85c mid 25c low -30c figure 5. output on-resistance vs motor power supply voltage (output on-resistance on high-side v m dependency, v cc =3v) figure 6. output on-resistance vs motor power supply voltage (output on-resistance on low-side v m dependency, v cc =3v) operating range (2.0v to 9.0v) operating range (2.0v to 9.0v) downloaded from: http:///
datasheet d a t a s h e e t 7/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL timing chart table 1. i/o truth table input mode input output ps (note 3) ina inb outa outb output mode (note 4) in/in h l l z z open h l h l cw l h l h ccw h h l l short brake - l x x z z open l: low, h: high, x: dont care, z: high-impedance (note 3) ps=high: operation mode, ps=low: stand-by mode (note 4) cw: current flows from outa to outb, ccw: current flows from outb to outa figure 7. input-output ac characteristic v cc 0v 50% 100% 0% motor current control input t on t off 50% downloaded from: http:///
datasheet d a t a s h e e t 8/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL application example selection of components externally connected when using the circuit with changes to the external circuit c onstants, make sure to leave an adequate margin for external components including static and transitional char acteristics as well as dispersion of the ic. ps vcc 1f to 100f outa outb vm gnd bandgap tsd & uvlo a2 a3 a1 power save pgnd level shift & pre driver ina inb b3 b2 logic power-saving h: active l: stand-by motor control input bypass filter capacitor for power supply bypass filter capacitor for power supply h-bridge full on 1f to 100f c1 c3 b1 c2 downloaded from: http:///
datasheet d a t a s h e e t 9/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL power dissipation figure 8. power dissipation vs ambient temperature i/o equivalent circuits ps ina, inb vm, pgnd, outa, outb outa pgnd vm outb 200k ? 10k ? 200k ? 10k ? 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature : ta [c] power dissipation : pd [w] 0.72w 0.37w 85c downloaded from: http:///
datasheet d a t a s h e e t 10/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal(gnd) and large-current ground( pgnd) traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensur e that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this abs olute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consi deration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transis tor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from t he outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
datasheet d a t a s h e e t 11/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 9. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the c hange of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output curren t, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. disturbance light in a device where a portion of silicon is exposed to light such as in a wl-csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. downloaded from: http:///
datasheet d a t a s h e e t 12/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL ordering information b d 6 3 7 6 g u l - e 2 part number package gul:vcsp50l1 packaging and forming specification e2: embossed tape and reel marking diagram part number marking package orderable part number 6376 vcsp50l1 BD6376GUL-e2 vcsp50l1 (top view) part number marking lot numbe r 1pin mark 6376 downloaded from: http:///
datasheet d a t a s h e e t 13/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL physical dimension, tape and reel information package name vcsp50l1 downloaded from: http:///
datasheet d a t a s h e e t 14/14 tsz02201-0h3h0b600310-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.feb.2016 rev.003 www.rohm.com tsz22111 15 001 BD6376GUL revision history date revision changes 03.aug.2012 001 new release 06.feb.2014 002 p1 change [1-2ch] to [1ch] 10.feb.2016 003 applied the rohm standar d style and improved understandabilit y . downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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